The present invention stacks integrated circuits (ICs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided herein. In a preferred embodiment...http://www.google.es/patents/US20060008945?utm_source=gb-gplus-sharePatente US20060008945 - Integrated circuit stacking system and method
Número de solicitud: 11/221,597 Número de publicación: US 2006/0008945 A1 Fecha de presentación: 7 Sep 2005 Patente emitida: US7524703 ( Fecha de emisión 28 Abr 2009)
