In a method of manufacturing an electronic component package, first, a plurality of sets of external connecting terminals corresponding to a plurality of electronic component packages are formed by plating on a top surface of a substrate to thereby fabricate a wafer. The wafer includes a plurality of...http://www.google.es/patents/US7816176?utm_source=gb-gplus-sharePatente US7816176 - Method of manufacturing electronic component package
Method of manufacturing electronic component package
