In an apparatus for forming filled via holes in ceramic substrates or wafers, upper and lower masks or dies each having at least one hole are clamped between opposing injection and base members with a wafer placed between the masks. The injection member has an injection chamber containing conductive...http://www.google.es/patents/US5242641?utm_source=gb-gplus-sharePatente US5242641 - Method for forming filled holes in multi-layer integrated circuit packages
Method for forming filled holes in multi-layer integrated circuit packages
