A semiconductor chip connection component having numerous leads extending side-by-side across a gap in a support structure, each lead having a frangible section to permit detachment of one end of the lead from the support structure in a bonding process. The frangible sections are formed by...http://www.google.es/patents/US5821609?utm_source=gb-gplus-sharePatente US5821609 - Semiconductor connection component with frangible lead sections
Semiconductor connection component with frangible lead sections
