A single use processing substrate including a first cut-resistant layer having a first surface area and including an absorbent ply and a thermoplastic material ply, wherein the first layer includes a plurality of non-circular apertures therein and a second layer having a second surface area and including...http://www.google.es/patents/US20030228443?utm_source=gb-gplus-sharePatente US20030228443 - Processing substrate and/or support surface
Número de solicitud: 10/364,491 Número de publicación: US 2003/0228443 A1 Fecha de presentación: 11 Feb 2003 Patente emitida: US7022395 ( Fecha de emisión 4 Abr 2006)
