A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal nano paste on each electrode, a primary bonding mechanism (50)...http://www.google.es/patents/US7743964?utm_source=gb-gplus-sharePatente US7743964 - Bonding apparatus and bonding method
