A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor die to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare...http://www.google.es/patents/US20070059984?utm_source=gb-gplus-sharePatente US20070059984 - Modular sockets using flexible interconnects
Número de solicitud: 11/600,395 Número de publicación: US 2007/0059984 A1 Fecha de presentación: 16 Nov 2006 Patente emitida: US7367845 ( Fecha de emisión 6 May 2008)
