The present invention provides an electronic device package that can be fabricated using standard package fabrication technologies while providing a desired level of thermal transfer capability to an attachable thermal management system. The electronic device package according to the present invention...http://www.google.es/patents/US7505268?utm_source=gb-gplus-sharePatente US7505268 - Electronic device package with an integrated evaporator
Electronic device package with an integrated evaporator
