A system and method of selectively etching copper surfaces free of copper oxides in preparation for the deposition of an interconnecting metallic material is provided. The method removes metal oxides with .beta.-diketones, such as Hhfac. The Hhfac is delivered into the system in vapor form, and reacts...http://www.google.es/patents/US5939334?utm_source=gb-gplus-sharePatente US5939334 - System and method of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxides
System and method of selectively cleaning copper substrate surfaces, in-situ ...
