Structures, in various embodiments, are provided using capacitive techniques to reduce noise in high speed interconnections, such as in CMOS integrated circuits. In an embodiment, a transmission line is disposed on a first layer of insulating material, where the first layer of insulating has a thickness...http://www.google.es/patents/US7737536?utm_source=gb-gplus-sharePatente US7737536 - Capacitive techniques to reduce noise in high speed interconnections
Capacitive techniques to reduce noise in high speed interconnections
