A metal film is deposited on both sides of a semiconductor wafer. A conductive support layer, e.g. gold, is deposited on one of the metal film layers. Using standard procedures, the semiconductor material is then etched to form a plurality of semiconductor devices on the support. A photoresist is next...http://www.google.es/patents/US4080722?utm_source=gb-gplus-sharePatente US4080722 - Method of manufacturing semiconductor devices having a copper heat capacitor and/or copper heat sink
Method of manufacturing semiconductor devices having a copper heat capacitor ...
