Circuit boards, microelectronic devices, and other apparatuses having slanted vias are disclosed herein. In one embodiment, an apparatus for interconnecting electronic components includes a dielectric portion having a first surface and a second surface. A first terminal is disposed on the first surface...http://www.google.es/patents/US20060046537?utm_source=gb-gplus-sharePatente US20060046537 - Slanted vias for electrical circuits on circuit boards and other substrates
Slanted vias for electrical circuits on circuit boards and other substrates
Número de solicitud: 10/927,760 Número de publicación: US 2006/0046537 A1 Fecha de presentación: 27 Ago 2004 Patente emitida: US7083425 ( Fecha de emisión 1 Ago 2006)
