The specification describes a thermocompression bonding process using anisotropic conductive film (ACF) bonding material in which the bonding pads are shaped to prevent depletion of conductive particles in the bonding region during compression. The process is useful in bump technology for interconnecting...http://www.google.es/patents/US5903056?utm_source=gb-gplus-sharePatente US5903056 - Conductive polymer film bonding technique
