A structure and method are provided for dissipating heat from a semiconductor device chip. A first layer of a dielectric material (e.g. polyimide) is formed on a front side of a heat spreader (typically Si). A plurality of openings are formed through this first layer; the openings are filled with metal...http://www.google.es/patents/US7049695?utm_source=gb-gplus-sharePatente US7049695 - Method and device for heat dissipation in semiconductor modules
Method and device for heat dissipation in semiconductor modules
