Microelectronic devices, methods for packaging microelectronic devices, and methods for forming vias and conductive interconnects in microfeature workpieces and dies are disclosed herein. In one embodiment, a method includes forming a bond-pad on a die having an integrated circuit, the bond-pad being...http://www.google.es/patents/US20060216862?utm_source=gb-gplus-sharePatente US20060216862 - Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
Microelectronic devices, methods for forming vias in microelectronic devices ...
Número de solicitud: 11/430,735 Número de publicación: US 2006/0216862 A1 Fecha de presentación: 9 May 2006 Patente emitida: US7759800 ( Fecha de emisión 20 Jul 2010)
