Chemical vapor deposition processes are employed to fill high aspect ratio (typically at least 3:1), narrow width (typically 1.5 microns or less and even sub 0.13 micron) gaps with significantly reduced incidence of voids or weak spots. This deposition process involves the use of hydrogen and a phosphorus...http://www.google.es/patents/US7001854?utm_source=gb-gplus-sharePatente US7001854 - Hydrogen-based phosphosilicate glass process for gap fill of high aspect ratio structures
Hydrogen-based phosphosilicate glass process for gap fill of high aspect ...
