A multi-chip semiconductor device includes a substrate, a first semiconductor chip, a second semiconductor chip, and a plastic mold. The first semiconductor chip has a function for executing a predetermined electrical operation and is installed on the substrate. The second semiconductor chip is installed...http://www.google.es/patents/US7399660?utm_source=gb-gplus-sharePatente US7399660 - Multi-chip semiconductor device with high withstand voltage, and a fabrication method of the same
Multi-chip semiconductor device with high withstand voltage, and a ...
