Piezoelectric fan assemblies are provided to provide a conduction path and forced convection for space-limited electronic devices in accordance with embodiments of the present invention. The fan blade of a piezoelectric fan is thermally coupled to the heat source, such as, but not limited to, the fins...http://www.google.es/patents/US20040253130?utm_source=gb-gplus-sharePatente US20040253130 - Electronic thermal management
Número de solicitud: 10/337,909 Número de publicación: US 2004/0253130 A1 Fecha de presentación: 6 Ene 2003 Patente emitida: US7031155 ( Fecha de emisión 18 Abr 2006)
