A thin film semiconductor die circuit package is provided utilizing low dielectric constant (k) polymer material for the insulating layers of the metal interconnect structure. Five embodiments include utilizing glass, glass-metal composite, and glass/glass sandwiched substrates. The substrates form the...http://www.google.es/patents/US7977763?utm_source=gb-gplus-sharePatente US7977763 - Chip package with die and substrate
