A tape ball grid array (TBGA) semiconductor package having a one metal layer interconnect substrate is provided. Further provided is a method for making the TBGA package having electrical connection through the one metal layer interconnect substrate down to a ground plane. The method includes: (a) defining...http://www.google.es/patents/US6395582?utm_source=gb-gplus-sharePatente US6395582 - Methods for forming ground vias in semiconductor packages
Methods for forming ground vias in semiconductor packages
