A flexible column interconnect for a microelectronic substrate includes a plurality of conductive columns extending from a bond pad or other conductive terminal in substantially mutually parallel arrangement, providing redundant current paths between the bond pad and a common cap in the form of a contact...http://www.google.es/patents/US7491636?utm_source=gb-gplus-sharePatente US7491636 - Methods for forming flexible column die interconnects and resulting structures
Methods for forming flexible column die interconnects and resulting structures
