A soldering method aimed to obtain higher bonding strength than conventionally obtained ones. With the soldering method according to the present invention, a Cu mounting surface is soldered with a preliminary solder comprising Sn-Cu, and a component is finally soldered to this preliminarily soldered...http://www.google.es/patents/US6334570?utm_source=gb-gplus-sharePatente US6334570 - Soldering method
