An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data conductor is coupled to the set of semiconductor...http://www.google.es/patents/US6583035?utm_source=gb-gplus-sharePatente US6583035 - Semiconductor package with a controlled impedance bus and method of forming same
Semiconductor package with a controlled impedance bus and method of forming same
