A plasma reactor for physical vapor deposition (PVD), also known as sputtering, which is adapted so that the atomic species sputtered from the target can self-sustain the plasma without the need of a working gas such as argon. The method is particularly useful for sputtering copper. According to the...http://www.google.es/patents/US5897752?utm_source=gb-gplus-sharePatente US5897752 - Wafer bias ring in a sustained self-sputtering reactor
Wafer bias ring in a sustained self-sputtering reactor
