A flip-chip package module consists of a semiconductor chip, a heat sink plate, a dielectric layer and a metal interconnect layer. The semiconductor chip has a positive side with a plurality of die pads located thereon and a back side for mounting onto the heat sink plate. The dielectric layer is formed...http://www.google.es/patents/US6639324?utm_source=gb-gplus-sharePatente US6639324 - Flip chip package module and method of forming the same
Flip chip package module and method of forming the same
