An integrated circuit package comprising a substrate, and a chip die mounted on the substrate. The substrate includes electrically conductive traces, a set of primary interconnects arranged to couple to output pads of the chip die, and a set of secondary interconnects for coupling the package to external...http://www.google.es/patents/US6583513?utm_source=gb-gplus-sharePatente US6583513 - Integrated circuit package with an IC chip and pads that dissipate heat away from the chip
Integrated circuit package with an IC chip and pads that dissipate heat away ...
