In a semiconductor device comprising a semiconductor chip, a heat radiation plate mounting the semiconductor chip thereon and having a plurality of rounded corner portions of a first radius, a ceramic substrate for mounting the heat radiation plate, and a metallize pattern formed onto the ceramic substrate...http://www.google.es/patents/US5610440?utm_source=gb-gplus-sharePatente US5610440 - Semiconductor devide having improved junction construction between heat radiation plate and ceramic substrate
Semiconductor devide having improved junction construction between heat ...
