Methods are provided for forming semiconductor packages utilizing a device-ready wafer having a through-wafer via interconnect. One exemplary method comprises etching a via extending from a first surface of the device-ready wafer and terminating within the wafer. The first surface of the device-ready...http://www.google.es/patents/US20060003566?utm_source=gb-gplus-sharePatente US20060003566 - Methods and apparatuses for semiconductor fabrication utilizing through-wafer interconnects
Methods and apparatuses for semiconductor fabrication utilizing through ...
