A process facilitates manufacturing a multiple layer wiring board having therein a thin-film capacitor The process includes: forming a metallic film layer having a barrier metal layer and a metal layer to be sequentially anode oxidized on an insulating layer first conductor pattern; covering a lower...http://www.google.es/patents/US6754952?utm_source=gb-gplus-sharePatente US6754952 - Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated
Process for manufacturing multiple layer wiring substrate onto which thin ...
