The present invention relates to a process for forming a near-planar or planar layer of a conducting material, such as copper, on a surface of a workpiece using an ECMPR technique. The process preferably uses at least two separate plating solution chemistries to form a near-planar or planar copper layer...http://www.google.es/patents/US20030119311?utm_source=gb-gplus-sharePatente US20030119311 - Planar metal electroprocessing
Número de solicitud: 10/201,606 Número de publicación: US 2003/0119311 A1 Fecha de presentación: 22 Jul 2002 Patente emitida: US6867136 ( Fecha de emisión 15 Mar 2005)
