A multi-layer circuit board is disclosed which includes a plurality of AlN ceramic layers stocked and combined as an integrated form and wiring layers interposed at different levels between the AlN ceramic layers. The wiring layers are made of a mixture of tungsten and AlN ceramic particles, the content...http://www.google.es/patents/US4724283?utm_source=gb-gplus-sharePatente US4724283 - Multi-layer circuit board having a large heat dissipation
Multi-layer circuit board having a large heat dissipation
