Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required...http://www.google.es/patents/US8189342?utm_source=gb-gplus-sharePatente US8189342 - Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly
Printed circuit board for memory module, method of manufacturing the same ...
