In an integrated circuit packaging structure, such as in an MCM or in a SCM, a compliant thermally conductive material is applied between a heat-generating integrated circuit chip and a substrate attached thereto. Raised regions are defined on the back side of the chip aligned to areas of a higher than...http://www.google.es/patents/US20050127500?utm_source=gb-gplus-sharePatente US20050127500 - Local reduction of compliant thermally conductive material layer thickness on chips
Local reduction of compliant thermally conductive material layer thickness ...
