An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-chip pads define an...http://www.google.es/patents/US6605489?utm_source=gb-gplus-sharePatente US6605489 - Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded ...
