A semiconductor multi-package module having stacked second and first packages, each package including a die attached to a substrate, in which the first and second package substrates are interconnected by wire bonding, and in which the first package is a flip chip ball grid array package in a die-up configuration....http://www.google.es/patents/US7935572?utm_source=gb-gplus-sharePatente US7935572 - Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages
Semiconductor multi-package module having package stacked over die-up flip ...
