A circuit board and a method for fabricating the same are provided. The circuit board includes a core board, a first bonding layer disposed on the core board, and a first wiring layer disposed on the first bonding layer. The first bonding layer enables the first wiring layer to be bonded to the core...http://www.google.es/patents/US20090038838?utm_source=gb-gplus-sharePatente US20090038838 - CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
Número de solicitud: 12/188,551 Número de publicación: US 2009/0038838 A1 Fecha de presentación: 8 Ago 2008 Patente emitida: US8058568 ( Fecha de emisión 15 Nov 2011)
