A clamping ring design that eliminates the Wafer sticking problem. In the first embodiment of the present invention the wafer clamp ring is redesigned to sharply reduce the wafer to wafer-ring contact area. In the second embodiment of the present invention a clamp ring guide is added to prolong the lifetime...http://www.google.es/patents/US6162336?utm_source=gb-gplus-sharePatente US6162336 - Clamping ring design to reduce wafer sticking problem in metal deposition
Clamping ring design to reduce wafer sticking problem in metal deposition
