A molding method for a BGA semiconductor chip package comprising a substrate supporting an array of chips having two lines of bonding pads formed at two respective side thereof. The molding method comprises the steps of: (A) providing a molding apparatus comprising a molding die having a molding cavity...http://www.google.es/patents/US6338813?utm_source=gb-gplus-sharePatente US6338813 - Molding method for BGA semiconductor chip package
