A system and method for providing compliant mapping between chip bond locations of an IC and corresponding package bond locations is disclosed. Package design information including package bond location information relating to the IC package and IC mask data including chip bond location information relating...http://www.google.es/patents/US20040025126?utm_source=gb-gplus-sharePatente US20040025126 - System and method for providing compliant mapping between chip bond locations and package bond locations for an integrated circuit
System and method for providing compliant mapping between chip bond ...
Número de solicitud: 10/212,360 Número de publicación: US 2004/0025126 A1 Fecha de presentación: 5 Ago 2002 Patente emitida: US8181125 ( Fecha de emisión 15 May 2012)
