An integrated circuit package system is provided including providing a wafer with bond pads formed on the wafer. A solder bump is deposited on one or more bond pads. The bond pads and the solder bump are embedded within a mold compound formed on the wafer. A groove is formed in the mold compound to expose...http://www.google.es/patents/US7652376?utm_source=gb-gplus-sharePatente US7652376 - Integrated circuit package system including stacked die
Integrated circuit package system including stacked die
