A bi-level, multilayered package with an integral window for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC)...http://www.google.es/patents/US6495895?utm_source=gb-gplus-sharePatente US6495895 - Bi-level multilayered microelectronic device package with an integral window
Bi-level multilayered microelectronic device package with an integral window
