A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected...http://www.google.es/patents/US6746897?utm_source=gb-gplus-sharePatente US6746897 - Fabrication process of semiconductor package and semiconductor package
Fabrication process of semiconductor package and semiconductor package
