A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective...http://www.google.es/patents/US7091109?utm_source=gb-gplus-sharePatente US7091109 - Semiconductor device and method for producing the same by dicing
Semiconductor device and method for producing the same by dicing
