A process for fabricating a plurality of solder joints from a low melting point solder paste and high melting point solder balls is described. An abbreviated process flow is as follows: First, the solder balls are placed into cavities in an alignment boat, a vacuum is initiated to hold the boat and solder...http://www.google.es/patents/US5118027?utm_source=gb-gplus-sharePatente US5118027 - Method of aligning and mounting solder balls to a substrate
Method of aligning and mounting solder balls to a substrate
