A semiconductor device includes a package substrate and a semiconductor chip provided on the package substrate, wherein there is provided a jumper substrate carrying thereon electrodes and conductor patterns that connect the electrodes, such that the jumper substrate is mounted upon the package substrate...http://www.google.es/patents/US5578525?utm_source=gb-gplus-sharePatente US5578525 - Semiconductor device and a fabrication process thereof
Semiconductor device and a fabrication process thereof
