Thin semiconductor die packages and associated systems and methods are disclosed. A package in accordance with a particular embodiment includes a semiconductor die having die bond sites, a conductive structure positioned proximate to the semiconductor die and having first bond sites and second bond sites...http://www.google.es/patents/US7816750?utm_source=gb-gplus-sharePatente US7816750 - Thin semiconductor die packages and associated systems and methods
Thin semiconductor die packages and associated systems and methods
