A method and device for providing a relief area on the surface of a molded I/C package. Specifically, a method of reducing delamination at the gate area of a molded I/C package by disposing an area of patterned metal traces on the substrate surface to form a relief area. The relief area will permit the...http://www.google.es/patents/US6473311?utm_source=gb-gplus-sharePatente US6473311 - Gate area relief strip for a molded I/C package
