Methods of forming integrated circuit packages having an LED molded into the package, and the integrated circuit package formed thereby. An integrated circuit including one or more semiconductor die, passive components and an LED may be assembled on a panel. The one or more semiconductor die, passive...http://www.google.es/patents/US8022417?utm_source=gb-gplus-sharePatente US8022417 - Method of assembling semiconductor devices with LEDS
Method of assembling semiconductor devices with LEDS
