A stackable integrated circuit chip package comprising a flex circuit. The flex circuit itself comprises a flexible substrate having opposed, generally planar top and bottom surfaces. Disposed on the top surface is a first conductive pad array, while disposed on the bottom surface is a second conductive...http://www.google.es/patents/US6473308?utm_source=gb-gplus-sharePatente US6473308 - Stackable chip package with flex carrier
