Specific embodiments of the present invention provide a method for chemical-mechanical planarization of an object. The method comprises performing a first planarization of the object using a first polishing pad having a smaller surface area than the object being planarized in a processing module; and...http://www.google.es/patents/US6692339?utm_source=gb-gplus-sharePatente US6692339 - Combined chemical mechanical planarization and cleaning
Combined chemical mechanical planarization and cleaning
